A method for manufacturing a semiconductor device includes (a) forming electrical
interconnections over a surface of a semiconductor substrate having integrated
circuits, (b) providing a plurality of bonding pads disposed on the surface of
the semiconductor substrate, (c) electrically connecting the electrical connections
to respective bonding pads of the plurality of bonding pads, (d) electrically connecting
the plurality of bonding pads to each of the integrated circuits, (e) forming resin
layers so as to cover the electrical interconnections, (f) forming concave portions
by a first process, each of the concave portions being disposed in a corresponding
portion of the resin layers that cover the electrical interconnections, (g) curing
the resin layers having the concave portion, (h) forming through-holes by removing
bottoms of the concave portions by a second process that differs from the first
process and (i) forming external connection terminals, each being disposed on a
corresponding area of the electrical interconnections exposed through the through-holes.
