A method of forming a pattern of elements is shown. In one embodiment, the method
is used to create a reticle. In another embodiment, the method is used to further
form a number of elements on a surface of a semiconductor wafer. A pattern on a
reticle is first generated using a medium such as computer software to interconnect
a number of active areas on the wafer. The pattern is then modified according to
a number of rules to create a pattern where substantially all spaces between planned
elements exhibit a desired gap width. Layers of elements such as trace lines can
be better covered with an ILD in a simplified deposition process as a result of
the novel pattern formation described herein.
