A heat sink assembly for a circuit board component is provided. that includes
a
heat sink base, a frame coupled to the base, and a cam positionable relative to
the base to lock the heat base to the circuit board component. The frame includes
an actuator that has a first post and a second post. Each post has an upper end,
a lower end, and a shaft portion therebetween. The lower end includes a retention
lug. A cross beam interconnects the shaft portions of the posts. The frame further
includes a board lock and the cam includes a lever coupled to the cam. The cam
engages the actuator to move the actuator relative to the frame from a first position
to a second position to lock the heat sink base to the circuit board component.
The heat sink remains in the locked position when the lever is rotated from the
second position to the first position.
