Disclosed is a high density plasma apparatus, which is capable of
preventing breakage of an insulation film due to a potential difference
by removing the potential difference in the course of transferring a
wafer from a process chamber to a transfer chamber after completing a
plasma process. The high density plasma apparatus may include a transfer
chamber including a wafer transfer robot; a process chamber connected to
the transfer chamber for plasma-processing a wafer being transferred by
the wafer transfer robot; and an ultraviolet irradiator provided in the
transfer chamber for irradiating an ultraviolet ray on the wafer
plasma-processed in the process chamber and being transferred to the
transfer chamber.
