Multilayer electronic component and manufacturing method thereof

   
   

A multilayer electronic component of the present invention includes dielectric layers (7) and internal electrode layers (5) that are alternatively laminated. The internal electrode layers (5) are exposed alternatively to opposite sides in a laminating direction. The multilayer electronic component has at both ends thereof external electrodes (3) connected to the internal electrode layers (5), and the thickness of a connected end of the internal electrode layers (5) with the external electrodes (3) is greater than the thickness of a non-connecting end. Therefore, even if the internal electrode layers (5) are thinned, the multilayer electronic component is excellent in electrical connection property between the internal electrode layer (5) and the external electrodes (5), thereby obtaining high electrostatic capacity.

 
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