The present invention provides a printed circuit board whose insulating layer
is not melt-adhered to a heating tool, to thereby enhance reliability and productivity
of a semiconductor chip mounting line, and also provides a method of producing
the printed circuit board. The printed circuit board contains a flexible printed
wiring board and a semiconductor chip mounted on the flexible printed wiring board,
wherein the flexible printed wiring board includes: an insulating layer 12 and
a wiring pattern 21 formed of a conductor layer 11 provided on at
least one side of the insulating layer 12 and a releasing layer 13 provided
on a surface of the insulating layer 12, which surface is opposite to the
mounting side of the semiconductor chip.
