An integrated circuit has a metal layer that includes conductors to provide interconnectivity
for components of the integrated circuit chip. The metal layer is divided into
at least two sections, such that a first section has a preferred direction and
the second section has a preferred wiring direction that is different from the
first preferred direction. The first and second preferred directions on a single
metal layer may consist of any direction. The metal layer may be divided into more
than two sections, wherein each section has a preferred wiring direction. Wiring
geometries for multi-level metal layers are also disclosed.
