A ball or land grid array plastic substrate portion is formed with a hole therethrough
in the region on which the integrated circuit die is to be formed, with a copper
heat slug inserted within the opening having a bottom surface substantially aligned
with the bottom surface of the plastic portion to allow molding tooling for conventional
ball or land grid array packages to be employed. The integrated circuit die is
mounted on the heat slug, which has a solderable bottom surface and is directly
soldered to the PCB. An additional copper heat spreader region is formed on an
upper surface of the plastic portion.
