An optoelectronic component having a basic housing or frame (12) and at
least one semiconductor chip (20), specifically a radiation-emitting or
-receiving semiconductor chip, in a cavity (18) of the basic housing. In
order to increase the efficiency of the optoelectronic component (10), reflectors
are provided in the cavity in the region around the semiconductor chip. These reflectors
are formed by virtue of the fact that a filling compound (28) filled at
least partly into the cavity (18) is provided, the material and the quantity
of the filling compound (28) being chosen in such a way that the filling
compound, on account of the adhesion force between the filling compound and the
basic housing, assumes a form which widens essentially conically from bottom to
top in the cavity, and the conical inner areas (30) of the filling compound
serve as reflector.
