A semiconductor integrated circuit is adhered to the substrate and includes semiconductor
integrated circuit electrodes. A hardened adhesive agent layer is formed from an
adhesive agent with gradable adhesiveness and has conductor bodies buried therein.
The adhesive agent includes a (meth)acrylate copolymer having a weight-average
molecular weight of not less than 30,000, an epoxy resin having a weight-average
molecular weight of 100 to 10,000, a photopolymerizable low molecular compound
and thermal activation latent epoxy resin curing agent. The conductor bodies are
connected with the semiconductor integrated circuit electrodes, and the adhesive
agent layer is aligned with the substrate so that the conductor bodies buried in
the adhesive agent layer and the substrate electrodes are electrically connected.
