A semiconductor device is provided including a semiconductor element having a
plurality
of electrodes, a plurality of bonding portions of a lead frame, a plate-like current
path material which electrically connects at least one of the plurality of electrodes
and one of the plurality of bonding portions, a housing which packages the semiconductor
element having the plurality of electrodes, the plurality of bonding portions of
the lead frame, and the current path material, wherein the plate-like current path
material is arranged to be directly bonded to one of the plurality of electrodes
and one of the plurality of bonding portions, and the middle portion of the current
path material is formed apart from the surface of the semiconductor element. A
method of manufacturing the same is also provided.
