A method and system are taught for a system comprising an LED package. The LED
package may comprise a leadframe having an annular contact and a base contact.
An LED die may be coupled to the annular and base contacts such that the P-type
material portion is electrically connected to an annular contact and the N-type
material portion is electrically connected to a base contact. Alternatively the
N-type material portion may be electrically connected to the annular contact and
the P-type material portion may be electrically connected to the base contact.
A lens may be coupled to the leadframe, and an optical material may be located
in a cavity defined by the lens, the base contact, and the annular contact. The
optical material may be a gel, a grease, a resilient material, a non-resilient
material, a rigid material, a liquid material or a non-liquid material. The method
and system may further comprise a mounting device, wherein the LED package is mechanically
coupled to the mounting device in a socket, bayonet, or threaded fashion. The method
and system may further comprise a strip comprising an array of annular contacts
utilized to form an array of the LED packages and a carrier strip comprising receiving
devices to receive the array of LED packages. A portion of the lens may either
be coated with or comprise light excitable material or the optical material may
comprise light excitable material, such that the system emits white light.
