A system and a method for using parallel heat exchangers to disperse heat from
a mobile computing system are disclosed. In one possible embodiment, multiple heat
exchangers are thermally coupled to a thermal attach platform. Multiple remote
heat exchangers may be thermally coupled to the thermal attach platform using a
heat pipe for each remote heat exchanger or a single heat pipe for all the remote
heat exchangers. In one embodiment, the thermal attach platform may be a copper
block or a heat pipe chamber. An air circulation unit may be coupled adjacent to
each remote heat exchanger. Direct attachment heat exchangers may be directly attached
to the thermal attach platform. An air circulation unit, such as a fan, may be
coupled adjacent to the direct attachment heat exchanger, either vertically or horizontally.
