Integrated circuit (IC) packages employing two-phase microchannel heat
exchangers for cooling the packages' IC dies and cooling systems employing the
same are disclosed. The heat exchangers include thermal masses having a plurality
of microchannels formed therein. In one set of configurations, the IC die is thermally
coupled to a pair of microchannel heat exchangers disposed on opposite sides of
the die. Top-side microchannel heat exchangers include a thermal mass having a
plurality of open microchannels having wall bases that are hermetically sealed
with the top surface of the die, thus forming a plurality of closed microchannels.
Alternatively, a separate microchannel heat exchanger is thermally coupled to an
IC die and operatively coupled to the IC die via coupling to a substrate on which
the IC die is mounted. Bottom-side heat exchangers include substrates and chip
carriers having microchannels formed therethrough that are thermally coupled to
the IC die. The cooling systems employ a plurality of microchannel heat exchangers
to cool selected electronic components.
