Epoxy, epoxy system, and method of forming a conductive adhesive connection

   
   

The invention encompasses epoxies, epoxy systems, and methods of forming conductive adhesive connections between electrical nodes. An epoxy contains: a) a liquid mixture of a hardener and a base epoxy; and b) a concentration of an ionic salt within the liquid mixture, the concentration of the ionic salt being high enough that a 15 mil length sample of the liquid mixture having cross-sectional dimensions of 50 mil by 2 mil would have a resistance of less than about 100 ohms along its length.

 
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