This invention relates to novel epoxy resins and epoxy resin compositions comprising
said epoxy resins or cured articles thereof. The cured articles have excellent
properties in respect to flame retardance, adhesiveness, moisture resistance and
heat resistance and can be used in applications such as lamination, molding, casting
and adhesion. The epoxy resins of this invention are represented by the following
formula (3)
##STR1##
wherein Y1 denotes a glycidyloxyarylmethyl group represented by
CH2ArOG, Y2 and Y3 denote
independently a glycidyl group or the aforementioned glycidyloxyarylmethyl group,
Ar denotes a phenylene group which can be substituted with up to two hydrocarbon
groups and G denotes a glycidyl group.