A fixing apparatus includes a fixing device configured to, by allowing a sheet
having a developing agent image on it to pass between a heating roller and a pressing
roller set in contact with the heating roller, fix the developing agent image in
which at least one of the heating roller and pressing roller is configured to have
an inner elastic layer and a conductive layer formed on a surface side of the elastic
layer and the elastic layer is bonded to the conductive layer by a heat-resistant
adhesive having a heat-resistant temperature of over 200 C.
