An integrated heat-dissipating module includes a heat-dissipating device substantially
in contact with a main heat-generating source on a motherboard, a casing capping
over the main heat-generating source and substantially in contact with sub heat-generating
sources installed around the main heat-generating source, and a heat-dissipating
fan installed on a first vent of the casing. The heat produced by the main heat-generating
source is transmitted to the air inside the casing via the heat-dissipating device.
Then, the hot airflow concentrated within the casing is expelled from a second
vent of the casing by the heat-dissipating fan. The casing is made of a high heat
conducting material and has a plurality of external heat-dissipating fins extending
outward from an outer surface of the casing for quickly transmitting the heat generated
by the sub heat-generating sources to the outside. Heat produced by the main heat-generating
source and the sub heat-generating sources is dissipated simultaneously.
