A drive cooling baffle suitable for rack mount computing systems is disclosed.
The drive cooling baffle generally includes a main body defining and extending
between inlet and outlet openings, at least one opening is configured to cooperate
with a fan to cool an electronics component, the main body portion being configured
to generally enclose the electronics component and hook and loop material such
as Velcro secured to an interior surface of the main body portion, the hook and
loop material being configured and disposed to engage with a corresponding hook
and loop material secured to the fan and/or the electronics component. The hook
and loop material may be secured to indentations defined in the interior surface
of the baffle. The baffle may include a flange to be in contact with an electronics
components base to which the baffle, the fan, and the electronics component are
attached, the flange being configured to engage with a hold down tab defined in
the electronics components base. The baffle may be made of a conductive plastic
material and/or may be coated with an electrically conductive coating on its interior
surface. The baffle may cooperate with an inflow and an outflow fan where the inflow
fan generates greater air movement than the outflow fan.
