An integrated circuit die includes an active area having source dopants and contacts.
An active area metal layer overlies the active area. A sense area is disposed on
the die. A sense area metal layer overlies the sense area. A plurality of polysilicon
gate stripes, polysilicon openings, and body stripes are disposed on the die, and
extend in a continuous and uninterrupted manner from the active area into the sense
area. A first region from which source dopants and contacts have been excluded
surrounds a periphery of the sense area. An etched region is disposed over the
first region, thereby separating and electrically isolating the sense area metal
layer from the active area metal layer.
