A multidie semiconductor device (MDSCD) package includes a generally planar interposer
comprising a substrate with a central receptacle, upper surface conductors, and
outer connectors on the lower surface of the interposer. Conductive vias connect
upper surface conductors with outer connectors. One or more semiconductor devices
may be mounted in the receptacle and one or more other semiconductor devices mounted
above and/or below the interposer and attached thereto. The package may be configured
to have a footprint not significantly larger than the footprint of the largest
device and/or a thickness not significantly greater than the combined thickness
of included devices. Methods for assembling and encapsulating packages from multidie
wafers and multi-interposer sheets or strips are disclosed. Methods for combining
a plurality of packages into a single stacked package are disclosed. The methods
may include use of somewhat laterally extending intermediate conductive elements,
flip-chip style electrical connection, or both within the same package.
