A semiconductor multi-package module has stacked lower and upper packages, each
of which includes a die attached to a substrate, in which the second package is
inverted, and in which the first and second substrates are interconnected by wire
bonding, and in which the first package includes a flip-chip ball grid array package
having a flip-chip in a die-down configuration. Also, a method for making a semiconductor
multi-package module, by providing a lower molded package including a lower substrate
and a flip-chip in a die-down configuration, affixing an upper molded package including
an upper substrate in inverted orientation onto the upper surface of the lower
package, and forming z-interconnects between the upper and lower substrates.
