Electrically, mechanically, and thermally enhanced ball grid array
(BGA) packages are described. An IC die is mounted in a centrally located cavity
of a substantially planar first surface of a stiffener. The first surface of a
substrate is attached to a substantially planar second surface of the stiffener.
The second surface of the stiffener is opposed to the first surface of the stiffener.
A centrally located protruding portion on the second surface of the stiffener is
opposed to the centrally located cavity. The protruding portion extends through
an opening in the substrate. A wire bond is coupled from a bond pad of the IC die
to a contact pad on the first surface of the substrate through a through-pattern
in the stiffener. The through-pattern in the stiffener is one of an opening through
the stiffener, a recessed portion in an edge of the stiffener, a notch in an edge
of the recessed portion, and a notch in an edge of the opening.
