A semiconductor die has a bonding pad for a MOSFET such as a power MOSFET and
a
separate bonding pad for ESD protection circuitry. Connecting the bonding pads
together makes the ESD protection circuitry functional to protect the MOSFET. Before
connecting the bonding pads together, the ESD protection circuitry and/or the MOSFET
can be separately tested. A voltage higher than functioning ESD protection circuitry
would permit can be used when testing the MOSFET. A packaging process such as wire
bonding or attaching the die to a substrate in a flip-chip package can connect
the bonding pads after testing.
