A semiconductor component includes a substrate, bonding pads on the substrate,
and external contacts bonded to the bonding pads. Exemplary external contacts include
solder balls, solder bumps, solder columns, TAB bumps and stud bumps. Preferably
the external contacts are arranged in a dense array, such as a ball grid array
(BGA), or fine ball grid array (FBGA). The component also includes a polymer support
member configured to strengthen the external contacts, absorb forces applied to
the external contacts, and prevent separation of the external contacts from the
bonding pads. In a first embodiment, the polymer support member comprises a cured
polymer layer on the substrate, which encompasses the base portions of the external
contacts. In a second embodiment, the polymer support member comprises support
rings which encompass the base portions of the external contacts. In either embodiment
the polymer support member transfers forces applied to the external contacts away
from the interface with the bonding pads, and into the center of the contacts.
