A heat exchanger utilizing active fluid transport of a heat transfer fluid has
multiple discrete flow passages provided by a simple but versatile construction.
The microstructured channels are replicated onto a film layer which is utilized
in the fluid transfer heat exchanger. The surface structure defines the flow channels
which are generally uninterrupted and highly ordered. These flow channels can take
the form of linear, branching or dendritic type structures. A cover layer having
favorably thermal conductive properties is provided on the structured bearing film
surface. Such structured bearing film surfaces and the cover layer are thus used
to define microstructure flow passages. The use of a film layer having a microstructured
surface facilitates the ability to highly distribute a potential across the assembly
of passages to promote active transport of a heat transfer fluid. The thermally
conductive cover layer then effects heat transfer to an object, gas, or liquid
in proximity with the heat exchanger.
