A method of manufacturing a semiconductor device comprising the steps of: preparing
a flexible substrate which includes a base substrate having a light transmission
property and an interconnecting pattern formed on one surface of the base substrate,
the flexible substrate allowing a light to pass through a region other than the
interconnecting pattern; recognizing a position of the interconnecting pattern
by viewing the flexible substrate from a surface opposite to the surface on which
the interconnecting pattern is formed through the base substrate; recognizing positions
of electrodes formed on a semiconductor chip from a direction identical to that
in recognizing the interconnecting pattern; and aligning the interconnecting pattern
with the electrodes to connect the flexible substrate to the semiconductor chip
by the face down bonding.
