Generally, a method for pre-cleaning native oxides and other contaminants
from apertures on a substrate is provided. In one embodiment, a method for pre-cleaning
apertures on a substrate includes disposing the substrate on a support member in
a process chamber, cooling the substrate at least to a temperature of 100 degrees
Celsius, and exposing the substrate to a pre-clean process. In another embodiment,
a method for pre-cleaning apertures on a substrate includes cooling the substrate
at least to a temperature of 100 degrees Celsius in a first chamber, transferring
the substrate to a second chamber and pre-cleaning the substrate in the second
chamber while maintaining a substrate temperature of 100 degrees Celsius.
