There is disclosed a TAB style BGA type semiconductor device. This semiconductor
device comprises a semiconductor chip on which an integrated circuit is formed,
and a polyimide tape which has a conductive pattern and which is allowed to adhere
to the semiconductor chip. The conductive pattern includes a bonding portion connected
to the pad of the semiconductor chip, a pad portion connected to the outside electrode,
and an electrically floating island-like portion in addition to a wiring portion
for connecting the bonding portion and the pad portion.
