The present invention relates to leads of a No-Lead type package which includes
a chip having an active surface and a rear surface opposite the active surface.
The active surface has a plurality of connection points with a plurality of leads
arranged around the perimeter of the chip and a first and a second surface orthogonal
to said first surface. A plurality of connection wires connect electrically the
bonding pads of the chip to the first surface of the leads respectively. The package
also includes a welding compound suitable for encapsulating the chip, the first
surface of the leads and the bonding pads. The leads possess at least one hole
in the second surface of the leads.
