A method of making semiconductor device packages includes the steps of attaching
a wafer to a dielectric layer, testing semiconductor devices in the wafer, and
then dicing the layered assembly. The dielectric layer may be, for example, a flexible
tape. The semiconductor devices may be chips containing integrated circuits or
memory devices. The dicing operation may be performed by a circular saw or by another
suitable apparatus. The chips may be connected to input/output devices, such as
ball grid arrays, on the dielectric layer, before the testing and dicing steps.
Full wafer testing may be-conducted through the ball grid arrays. A relatively
stiff metal sheet may be included in the layered assembly before the testing and
dicing steps. The metal material may be used as heat spreaders and/or as electrical
ground planes. The chips may be connected to the ball grid arrays by wire bonds
or flip chip bumps and vias through the dielectric layer. Alignment of the wafer
with respect to the dielectric tape may be accomplished by an optical device or
by a magnetic system.
