A semiconductor device reduced in size is provided in which the surface area
outside
of a display portion required for IC chips to mounted is reduced in a semiconductor
device having an active matrix display portion. Further, signal wiring connection
defects that accompany IC chip mounting are reduced. By manufacturing TFTs on an
opposing substrate in a reflecting active matrix semiconductor device, thus manufacturing
a desired logic circuit, the logic circuit, conventionally mounted externally,
is formed on the opposing substrate. Further, the semiconductor device is made
high speed and high performance by using suitable TFT structures and electric power
source voltages for pixels and driver circuits on a pixel substrate and for the
logic circuit on the opposing substrate.
