An embodiment of the present invention pertains to encapsulating an organic electronic
device by selectively depositing a catalyst layer and then exposing the catalyst
layer to a monomer to produce a planarization layer. The monomer reacts only in
the areas where the catalyst layer is present so there is minimal or no contamination
of other areas of the organic electronic device. Selectively depositing the catalyst
layer allows the resulting planarization layer to be patterned. A barrier layer
is selectively deposited on at least the planarization layer.
Another embodiment of the present invention pertains to encapsulating an
organic electronic device by depositing a planarization layer on a transfer substrate
and then allowing it to stabilize to minimize its reactivity. The planarization
layer is transferred from the transfer substrate onto at least an active area of
the organic electronic device. A barrier layer is selectively deposited on at least
the planarization layer.
