A projection device is provided, wherein the projection device includes a digital
micromirror device, a circuit board that further includes a first face and a second
face, an integrated heat sink/stiffener; and a plurality of engagement mechanisms,
wherein the plurality of engagement mechanisms is adapted to operatively couple
the digital micromirror device to the first face of the circuit board and to secure
the integrated heat sink/stiffener to the second face of the circuit board; and
wherein the integrated heat sink/stiffener is adapted to provide structural support
to the circuit board and to draw thermal energy away from the digital micromirror device.
