The invention encompasses methods of preparing interposers for utilization in
semiconductor packages. The invention includes a method in which an interposer
substrate having a surface and a conductive layer extending over the surface is
provided. Pads are formed on the conductive layer by plating a conductive material
on the conductive layer while using the conductive layer as an electrical connection
to a power source and without utilizing conductive busses, other than the conductive
layer. Subsequent to the formation of the pads, the conductive layer is patterned
into circuit traces. Methodology of the present invention can be utilized for,
for example, forming board-on-chip constructions.
