A semiconductor component includes adjustment circuitry configured to adjust
selected
physical and electrical characteristics of the component or elements thereof, and
an input/output configuration of the component. The component includes a semiconductor
die, a substrate attached to the die, and terminal contacts on the substrate. The
adjustment circuitry includes conductors and programmable links, such as fuses
or anti-fuses, in electrical communication with the die and the terminal contacts.
The adjustment circuit can also include capacitors and inductance conductors. The
programmable links can be placed in a selected state (e.g., short or open) using
a laser or programming signals. A method for fabricating the component includes
the steps of forming the adjustment circuitry, and then placing the programmable
links in the selected state to achieve the selected adjustment.
