An aqueous chemical mechanical polishing slurry is provided that comprises precipitated
amorphous silica abrasive particles treated with acidic aluminum. Also provided
is a method of polishing an electronic component substrate comprising the steps
of: a) obtaining an electronic component substrate, the electronic component substrate
having an insulating film deposited over it, an interconnection pattern formed
in the insulating film, and interconnection material deposited on the insulated
film and in the interconnection pattern; and b) polishing the interconnection material
until a surface of said insulating film is exposed by using an aqueous chemical
mechanical polishing slurry comprising: precipitated amorphous silica abrasive
particles treated with acidic aluminum.
