A method of making a semiconductor package device includes attaching a semiconductor
chip to a metallic structure using an insulative adhesive, wherein the chip includes
a conductive pad, the metallic structure includes first and second opposing surfaces
and a lead, the adhesive is disposed between the first surface and the chip, the
lead includes a recessed portion, a non-recessed portion and opposing outer edges
between the first and second surfaces that extend across the recessed and non-recessed
portions, and the recessed portion is recessed relative to the non-recessed portion
at the second surface, forming an encapsulant that contacts the chip, the first
surface, the outer edges and the recessed portion, wherein the encapsulant completely
covers the chip, the outer edges and the recessed portion without completely covering
the non-recessed portion, and forming a connection joint that electrically connects
the lead and the pad.
