Methods for the production of ceramic chip capacitors include the deposition
of at least two layers of electrical conductor and at least one layer of a dielectric
between electrical conducting layers. The compositions in the dielectric layer
are deposited from a flow in which flowing reactants react to form particles in
a reaction driven by light at a light reaction zone. In some embodiments, a plurality
of dielectric layers is deposited. Suitable dielectric materials include barium
titanate. A collection of barium titanate particles can be formed in the coating
process having an average diameter less than about 90 nanometers. Thus, ceramic
chip capacitors can be formed with barium titanate particles having an average
diameter less than about 90 nanometers.
