Some embodiments of a method and apparatus for cooling integrated circuit devices
are described. In one embodiment, the apparatus includes a thermosiphon having
an evaporator portion coupled to a first surface of a heat source and a condenser
portion coupled to the evaporator portion distal from the first surface of the
heat source. A remote heat exchanger is coupled to the condenser of the thermosiphon.
In addition, one or more thermoelectric elements are coupled between the heat exchanger
and the condenser of the thermosiphon. In one embodiment, the remote heat exchanger,
the thermoelectric elements and the condenser portion of the thermosiphon are located
outside a chassis of a one rack unit (1U) server computer.
