An apparatus in which a device electrode pad in an electronic device and a connecting
conductor pattern in a substrate are connected to each other through a plurality
of wire thin lines which differ from one another in mechanical characteristic frequencies.
Even if the frequency of vibration applied to the apparatus from the exterior coincides
with the characteristic frequency of the given wire thin line so that the wire
thin line is broken, it does not coincide with the characteristic frequency of
the other wire thin line. Accordingly, no resonance phenomenon occurs in the other
wire thin line, thereby reducing a probability that the wire thin line is broken.
