There are provided a conductive pattern material and a pattern-forming method
by which a fine pattern having a high resolution and no wire breakage is obtained.
The conductive pattern material is such that on a support surface a pattern-forming
layer is formed which allows the formation of a hydrophilic/hydrophobic region
directly bonded to the support surface due to energy imparted. Energy is imparted
to the pattern-forming material in an imagewise manner to form the conductive material layer.
