A circuit module including at least one Application Specific Integrated Circuit
(ASIC) and a plurality of Vertical Cavity Surface-Emitting Laser (VCSEL) array
modules is built using a standard ceramic or organic Multi-Chip Module (MCM) package
substrate, resulting is a high density device with a small footprint. Interconnection
between the electronic devices and the VCSEL array modules is accomplished using
standard integrated circuit packaging technology and flexible connectors. Optical
connections from the VCSEL arrays to fiber optic cables are made possible by integrating
industry-standard optical connectors onto the package. Optical receiver and transceiver
modules may also be incorporated into the circuit module.
