Semiconductor memory device

   
   

Positive/negative bit lines are arranged on a second-layer interconnection the VDD power supply interconnection is arranged between the positive/negative bit lines, the word line is arranged on a third-layer interconnection, and the VSS power supply interconnection is arranged on a fourth-layer interconnection. Alternatively, the word line is arranged on the second-layer interconnection, the positive/negative bit lines are arranged on the third-layer interconnection, the VDD power supply interconnection is arranged between the positive/negative bit lines, and the VSS power supply interconnection is arranged on the fourth-layer interconnection. Alternatively, the VDD power supply interconnection is arranged on the second-layer interconnection, the positive/negative bit lines are arranged on the third-layer interconnection, the word line is arranged on the fourth-layer interconnection, and the VSS power supply interconnection is arranged on the fifth-layer interconnection.

 
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