Systems and methods for inspecting a surface of a specimen such as a semiconductor
wafer are provided. A system may include an illumination system configured to direct
a first beam of light to a surface of the specimen at an oblique angle of incidence
and to direct a second beam of light to a surface of the specimen at a substantially
normal angle. The system may also include a collection system configured to collect
at least a portion of the first and second beams of light returned from the surface
of the specimen. In addition, the system may include a detection system. The detection
system may be configured to process the collected portions of the first and second
beams of light. In this manner, a presence of defects on the specimen may be detected
from the collected portions of the first and second beams of light.
