Disclosed are a metallic nanoparticle cluster ink and a method for forming
a conductive metal pattern using the cluster ink. The metallic nanoparticle cluster
ink comprises colloidal metallic nanoparticles and a bifunctional compound. The
conductive metal pattern is formed by forming a metallic nanoparticle pattern on
a substrate using a mold made from PDMS (poly(dimethylsiloxane) polymer as a stamp,
and heat-treating the substrate. Micrometer-sized conductive metal patterns can
be easily formed on various substrates in a simple and inexpensive manner without
the use of costly systems, thereby being very useful in various industrial fields.