A system and method for measuring thermal distributions of an electronic device
during operation is disclosed. The system includes an electronic device, a heat
sink adjacent to the electronic device and an electrical-insulating layer disposed
on the electronic device so as to separate the electronic device and the heat sink.
The system further includes a plurality of thermal sensors located on the electrical-insulating
layer, each of the plurality of thermal sensors in a different location. The plurality
of thermal sensors is located within one or more thin film circuit layers disposed
adjacent to the electrical insulating layer. The system further includes a module
for receiving thermal information from the plurality of thermal sensors during
operation of the electronic device. The system further includes a processor coupled
to the module for generating a thermal distribution of the electronic device based
on the thermal information received from the plurality of thermal sensors.
