A luminescent diode chip for flip-chip mounting on a carrier, having a conductive
substrate (12), a semiconductor body (14) that contains a photon-emitting
active zone and that is joined by an underside to the substrate (12), and
a contact (18), disposed on a top side of the semiconductor body (14),
for making an electrically conductive connection with the carrier (30) upon
the flip-chip mounting of the chip, whereby either the carrier is solder covered
or a layer of solder is applied to the contact. An insulating means (40, 42,
44, 46, 48) is provided on the chip, for electrically insulating free faces
of the semiconductor body (14) and free surfaces of the substrate (12)
from the solder.
