A method of producing a thin, non-lead type semiconductor device superior in
packaging
performance is to be provided. A recess and grooves are formed on a main surface
of a conductive substrate in accordance with predetermined patterns to define plural
compartments surrounded with the recess and grooves, and plural product-forming
portions are formed each by one or plural recesses and plural compartments. Thereafter,
a back surface of a semiconductor element is fixed onto a depressed bottom of each
of the product-forming portions through an adhesive, then electrodes formed on
the semiconductor element and the compartments are connected with each other through
conductive wires, an insulating resin is formed on the main surface of the substrate
so as to cover the semiconductor element and the wires, then a back surface of
the substrate is removed a predetermined thickness, thereby allowing the compartments
to be electrically isolated each independently and allowing the adhesive to be
exposed, a plating film is formed on surfaces of the compartments exposed to a
surface of the resin layer, and the resin layer is cut along boundary portions
of the product-forming portions to fabricate plural, thin, non-lead type semiconductor
devices in each of which the back surface of the semiconductor element is lower
than the main surfaces of the compartments.
