The present invention provides an information carrier which has flat surfaces,
is excellent in beautiful appearance and permits beautiful necessary printing,
and a production process which permits easy and inexpensive production of such
an information carrier. An IC chip 1 and a coil 2 connected to the
IC chip are embedded in a substrate 3 composed of a nonwoven fabric. The
IC chip and the coil are held between two nonwoven fabrics produced according to
a conventional production procedure. The laminate of the nonwoven fabrics is fed
to a roller or a press and the two nonwoven fabrics are hot-pressed, whereby their
mating surfaces are joined with or without an adhesive (including low-melting synthetic
resin fiber) incorporated into the webs. After positioning of the coil in the thus
obtained raw product of information carrier, the laminate of the nonwoven fabrics
and cover sheets is cut to obtain an information carrier of predetermined shape
and size.
